Good morning to you from SC24 in Atlanta. Here’s a quick (5:33) run-through of recent developments in the world of HPC-AI, ...

Every couple of years, Lawrence Livermore National Laboratory gets to install the world’s fastest supercomputer. And ...

Claims that Blackwell GPUs designed for AI tasks and HPC are overheating come from sources who spoke to The Information.

Nvidia's next-generation Blackwell processors are facing significant challenges with overheating when installed in ...

Ansys multiphysics analysis solutions are critical to the successful integration and performance of advanced multi-chip packaging and electronic and photonic co-packaged optics in TSMC's compact ...

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Emerging advanced semiconductor packaging technologies, such as 2.5D and 3D hybrid bonding, are crucial for enhancing system ...

HPC, and silicon systems growth would take demonstrably longer to develop and validate, and the associated costs would be much higher. Together, Ansys and TSMC push the industry forward by ...

Despite some capacity constraints at TSMC impacting near-term growth for peers ... Furthermore, Camtek is a leader in 2.5D and 3D packaging inspection, essential for AI and HPC chips, and is set to ...

was recognized at the TSMC 2024 Open Innovation Platform® (OIP) Partner of the Year awards for excellence in design enablement for AI, HPC, and photonics silicon systems. The awards honor TSMC ...

(OIP) Partner of the Year awards for excellence in design enablement for AI, HPC, and photonics silicon systems. The awards honor TSMC OIP ecosystem partners and their contributions to innovation ...